Packet Processing functions often need special-purpose hardware such as discrete NPUs, co-processors and FPGAs. However, recent improvements to Intel (News - Alert) architecture processors together with advanced software are offering developers a viable alternative. With these, users can use one-blade architecture for consolidation of all their Application, Control and Packet Processing workloads on Intel Architecture (IA).
Recently, Radisys Corporation (RSYS), a provider of embedded wireless infrastructure solutions and a member of the Intel Intelligent Systems Alliance, announced the industry’s first single 40 Gigabit Ethernet (GbE) controller solution for the Intel Data Plane Development Kit (Intel DPDK).
Offering the high throughput, Radisys’ 40G solution enhances the Intel DPDK beyond its current 10G functionality. The 40G DPDK solution allows Telecom Equipment Manufacturers (TEMs) to considerably decrease their cost-per-bit for Deep Packet Inspection (DPI) and security applications. Also, by using native 40G support, TEMs can shorten development time by up to 24 months by decreasing overall complexity and simplify their application development, the company stated in a release.
“Our solution provides TEMs with a scalable solution with true 40G performance, making this an ideal solution for a variety of form factors from ATCA, Rackmount Servers and Network Appliances, and even to software,” said Andrew Alleman, vice president, platform engineering, Radisys. “In addition to enhancing the functionality of the Intel DPDK, we at Radisys eagerly adopted the solution within our own wireless infrastructure platforms – including the RMS-220 network appliance – continuing our focus on simplifying our customers’ development environment.”
Recently, the company introduced a carrier-grade network appliance platform based on server-class Intel processors. By offering users a highly scalable design based on innovative next-generation technology, the RMS-220 solution will help meet increasing demands for Deep Packet Inspection (DPI) and networking applications. Containing four front I/O modules, five front storage modules (HDD or SSD), the Radisys RMS-220 boasts a 2U high, 20-inch deep form factor.
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Edited by Rachel Ramsey