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InterDigital and ASOCS's Joint Solution Likely to Ease-Up New Product Introduction in Wireless

Wireless Backhaul

Wireless Backhaul Industry News.

October 05, 2012

InterDigital and ASOCS's Joint Solution Likely to Ease-Up New Product Introduction in Wireless



In an effort to provide the industry with a fully-integrated 2G and 3G modem technology for wireless products and chipsets development, wireless technology company, InterDigital (News - Alert), and the well-known provider of many-core embedded processors, ASOCS Ltd., forged a strategic alliance.


The partnership will allow for the integration of InterDigital’s SlimChip WCDMA modem IP core and ASOCS’ ModemX platform and R4 GSM/GPRS/EDGE solution.

The industry will in turn gain a service that can be embedded into wireless product platforms and expedite the product rollouts, all the while providing an upgrade path to 4G technologies such as HSPA+, TD-SCDMA and LTE (News - Alert).

The joint solution supporting HSPA Category 10 (14.4 Mbps DL) and Category 6 (5.76 Mbps UL), as well as GPRS/EGPRS multi-slot class 12, is also likely to significantly reduce development risk and time to market.

Called SlimChip modem IP core transfer package, the combined offerings of ASOCS and InterDigital includes a complete 3GPP Release 6 compliant 3G physical layer (with direct upgrade path to Release 7), Release 4 compliant 2G physical layer and dual mode protocol stack implementation.

The solution is targeted at customers integrating GSM/WCDMA into multi-mode design with LTE or TD-SCDMA, or companies seeking to enter new market areas while reducing development costs and time.

“The path to new product introduction in wireless can be very challenging and, given the speed with which new players are emerging, any slowdown or mishap can have significant consequences for market penetration,” said Bill Miller (News - Alert), executive vice president of IP Sales and Services at InterDigital. “The combined solution by ASOCS and InterDigital is based on proven market-ready technologies, and should enable customers to roll out products quickly and effectively while building an upgrade path to 4G technologies into their roadmap.”

“The strategic alliance with InterDigital is an important milestone in our new strategy towards proliferation of our ModemX technology in the mobile world,” said ASOCS CEO Gilad Garon. “ModemX is displacing the traditional DSP approach, with a one-stop shop of flexibility and performance needed in today's low power designs. Our software-programmable architecture makes it easy for customers to quickly react to changes in their product roadmaps.”

In June this year, ASOCS released an infrastructure-based SIP solution targeted at Cloud Radio Access Networks and large scale Cooperative Communications.

“Following intensive and concrete discussions with key industry players both on the network operator side, as well as, CPU and server technology companies, we have crafted a co-processing architecture that is poised to improve system performance by more than Ten Fold (x10) over standalone x86 Intel (News - Alert) based servers,” added Garon.

Want to learn more about the latest in communications and technology? Then be sure to attend ITEXPO Austin 2012, happening now in Austin, TX. Stay in touch with everything happening at ITEXPO (News - Alert). Follow us on Twitter.




Edited by Braden Becker

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