NXP Semiconductors (News - Alert) N.V., provider of High Performance Mixed Signal and Standard Product solutions, today unveiled a new portfolio of LDMOS power transistors meant for use in small cell wireless base stations. The portfolio features dedicated solutions for both picocell and microcell architectures, spanning frequency ranges from 700 MHz to 2.7 GHz, also including the world's first asymmetric MMICs and low-cost, low-power plastic devices.
These high-performance RF power transistors provide balance in terms of energy efficiency and integration, resulting in a high degree of flexibility when designing highly scalable, cost-optimized systems. The entire portfolio is now being showcased at European Microwave Week in Amsterdam.
"Small cells are emerging as a cost-effective approach to increase wireless network capacity and quality of service, when used as a complement to macro base stations," said Christophe Cugge, director of marketing, base station power amplifiers, NXP Semiconductors. "By offering a broad portfolio of energy-efficient LDMOS power transistors dedicated to picocells, microcells and active antenna systems, we're providing the flexibility needed to build highly versatile, scalable small-cell solutions."
In terms of microcell solutions, NXP has introduced asymmetric and symmetric MMICs for dual-stage microcells, which provide more power efficiency at the back-off while offering increased flexibility, particularly in Doherty configurations in microcells and antenna arrays. The first MMIC based on NXP's Gen7 LDMOS technology, the BLM7G22S-60PB(G) is now available for purchase with qualification samples of seven prototypes available.
In terms of picocell solutions, the company now offers the plastic 10-W BLP7G22-10, which provides 17 dB gain at 2.0 GHz, while the 7.5-W BLP7G27-07 provides 15.3 dB gain at 2.6 GHz.
NXP recently release its third quarter financial results for fiscal year 2012, reporting an impressive $1.17 billion in revenue.
Also at European Microwave Week, Agilent Technologies is demonstrating the EMPro 2012, which makes it easier for designers to create 3D models and analyze the electrical performance of packages, connectors, antennas and other RF and high-speed components.
Edited by Rich Steeves