SUBSCRIBE TO TMCnet
TMCnet - World's Largest Communications and Technology Community
AOSL Introduces Ultra-Small IC Packages for Wireless Applications

Wireless Backhaul

Wireless Backhaul Industry News.

January 15, 2013

AOSL Introduces Ultra-Small IC Packages for Wireless Applications



As mobile devices have gotten smaller and portability has become a key element in the design process, smaller packages with superior performances have been developed by semiconductor and IC manufacturers.

The proliferation of phablets and tablet PCs, smartphones, digital media players and ultrabook computers that are power-efficient with superior performance capabilities has warranted the development of even smaller, less expensive and more powerful semiconductors with each passing year.


But Alpha and Omega Semiconductor Limited (AOSL) are clearly not slowing down in their quest for even smaller IC packages. The global designer, developer and supplier of semiconductor components, has introduced a family of tiny DFN device packages measuring 1.0mm x 0.6mm and 1.6mm x 1.6mm.

These semiconductor devices will meet the small footprint requirements of portable devices currently in development.

The AON1605 and the AON1606 are both housed in a 1.0mm x 1.6mm package and utilize advanced trench MOSFET technology, considered ideal for load switch applications. The AON1611, AON1620 and AON1634 are offered in 1.6mm x 1.6mm DFN packages.

These low-resistance packages provide extremely low drain source voltages and are considered ideal for load switch and battery protection applications. With low drain source voltages, these ICs will have less conduction losses, which translates to lower power consumption, low heating devices and longer battery lives – all of which are essential in wireless devices and applications. 

These devices will also serve well in space-constrained applications that require efficient power usage.

According to the director of low voltage MOSFETS at AOSL, Peter Wilson, “These new tiny DFN packages utilize AlphaMOS technology which enables exceptional performance and makes it possible for affordable form factor solutions for the wireless mobile market.”

These devices will be immediately available with a lead-time of 12 weeks, and their debut price will range from $0.08 to $0.25 per unit depending on the device.

More details will be available soon with local AOSL sales representatives.

Want to learn more about the latest in communications and technology? Then be sure to attend ITEXPO Miami 2013, Jan 29- Feb. 1 in Miami, Florida.  Stay in touch with everything happening at ITEXPO (News - Alert). Follow us on Twitter.




Edited by Braden Becker

Back to Wireless Backhaul Community





Technology Marketing Corporation

800 Connecticut Ave, 1st Floor East, Norwalk, CT 06854 USA
Ph: 800-243-6002, 203-852-6800
Fx: 203-866-3326

General comments: tmc@tmcnet.com.
Comments about this site: webmaster@tmcnet.com.

STAY CURRENT YOUR WAY

© 2013 Technology Marketing Corporation. All rights reserved.