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SMART Modular Technologies Debuts Module in a Package

SMART Modular Technologies Debuts Module in a Package

December 11, 2013
By Jayashree Adkoli, TMCnet Contributor
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With consumers seeking small footprint smart devices and gadgets, the demand for SO-DIMMS, or small outline dual in-line memory modules, has increased. Even though SO-DIMMs are the smaller alternative to DIMMs –which consume a lot of power, space and cost- there is one more alternative to SO-DIMM itself, the MIP (module in a package).


SMART Modular Technologies (News - Alert), Inc., a provider of memory and storage products, has announced the debut of MIP, which is a tiny form factor (TFF) memory module that combines the benefits of industry standard SO- DIMMs with SMART’s proprietary stacking technology.

Unlike an SO-DIMM, SMART’s MIP is a "soldered down" module that occupies 1/5th the area of a SO-DIMM, while offering higher performance and lower power.

To be precise, cites SMART Modular Technologies, the new MIP offers 42 percent more power savings, 42 percent jitter reduction and 39 percent PK/PK savings compared to SO-DIMMS available in the current market.

In addition, SMART’s MIPs include on-package address and control signal termination. This eliminates the need in DRAM-down board usage scenarios.

These features make the new SMART MIP ideal for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

Leveraging SMART's long-term, off-the-shelf stacking expertise, the new MIPs are offered in 2GB and 4GB densities; and run at speeds up to DDR3-2133. The MIPs have been tested at speeds up to DDR3-1866 and are offered in industrial grade-40°Cto+85°C, cites SMART in a statement.

"SMART has been stacking off-the-shelf DRAMs for many years providing key space-saving benefits to OEMs," said Mike Rubino, vice president of engineering, SMART Modular Technologies. "The MIP is a natural extension of this expertise furthering SMART's commitment to deliver high quality, high reliability unique memory solutions."

With the help of SMART’s new MIP, applications requiring huge memory capacity in a small footprint can benefit the most.

It is now considered one of the ideal memory solutions for the emergence of new cube computing applications in networking, telecom and computing segments.

Compared to other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.




Edited by Cassandra Tucker

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